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污染控制


半导体晶圆厂的污染控制是实现可接受器件产量的关键,因为特征尺寸减小和3D结构扩散。在整个工艺生命周期中,对空气、散装或特种气体和化学品的高级过滤和净化已成为减少缺陷和提高产量的关键方面。IDMs(集成设备制造商)继续对他们接收到的每一种化学物质和气体中的粒子、金属和有机物等参数严格执行可接受的规范。

颗粒、凝胶、金属和空气分子污染(AMC)都以不同的方式影响产品、工艺和设备,从而导致不良产品。液体过滤器和净化器提供了一道防线,以防止引起缺陷的污染物到达晶片和基片。无论是在使用点还是批量交付,在室或硅片上,在无尘室或在工具上,我们有悠久的历史,提供先进的液体、气体和空气净化和过滤解决方案,以满足您在任何技术节点的生产力和可靠性要求。


为化学制造的纯度而战

为化学制造的纯度而战

随着消费者给材料制造商带来新的挑战和机遇,我们都在经历数字化转型。随着集成电路(IC)技术的进步,污染控制仍然是最大的挑战之一。更好的污染控制可以显著提高产量,一个百分点的产量提高意味着每年高达1.5亿美元的净利润。


使用一个经验模型来弥合过滤间隙

Ashutosh Bhabhe,液体过滤应用的高级工程师,讨论了我们的经验模型,它结合了基础化学工程和integris的知识,是如何帮助散装化学品供应商选择正确的先进过滤器来保持纯度。液体净化与计量技术应用工程师Siddarth Sampath解释了如何使用该模型,该模型利用流速和保留属性来预测溶剂中的金属去除行为,从而帮助在整个供应链中提供优化过滤。
运行时:02:59


特色的见解

清洁的天然气输送

探索半导体制造商面临的气体纯度挑战的解决方案。

追逐完美的模式

半导体制造业的光刻机面临的挑战是创造出满足我们数字生活所依赖的电子设备的产量、参数性能和长期可靠性要求的电路模式。要做到这一点,预测和控制制造系统、材料和过程中的变量是至关重要的。

石印工的工具箱

lithographer 's toolkit提供了一个实用指南,以减少工艺变化,威胁您的半导体晶圆厂性能。

高纯化学制造

为了实现第四工业革命的电子设备的有效制造,FABS(集成电路制造商)挑战,生产密集和更复杂的芯片,具有较小的线间距和3D特征。随着消费者给材料制造商带来新的挑战和机遇,我们都在经历数字化转型。污染控制仍然是集成电路(IC)技术的最大挑战之一。

启用高级光刻技术(EUV)

EUV掩模版盒子是高度专业的设备,在EUV光刻中满足关键作用。它们必须在使用期间保护掩模版,而不是引入额外的污染或损坏。

半导体工厂罕见的空气

对空气分子污染物(AMC)的控制使集成电路(IC)制造商能够提高他们的生产良率,进一步确保电子设备的完整性。在整个fab环境和工具位置,通过AMC滤波器实现污染物去除。

对我们的污染控制解决方案感兴趣?

对我们的污染控制解决方案感兴趣?

对我们的污染控制解决方案感兴趣?

需要更多的细节或当地办事处的信息?

需要更多的细节或当地办事处的信息?

需要更多的细节或当地办事处的信息?